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      Samsung Electro-Mechanics and Qualcomm Collaborate on Advanced Packaging Technology

      Samsung Electro-Mechanics and Qualcomm are collaborating on the development of organic bridge technology for 2.1D packaging, a project that has been in progress for over a year. This innovative organic bridge technology is designed to connect multiple semiconductor chips within a single package, utilizing organic materials and substrate processes, similar to the silicon bridge technology employed by Intel in its Embedded Multi-Die Interconnect Bridge (EMIB).

      In this partnership, Samsung Electro-Mechanics integrates the organic bridge into Flip Chip Ball Grid Array (FC-BGA) substrates, which feature grooves that facilitate the connection of Qualcomm chips. The companies are currently assessing the performance and reliability of this technology, with Qualcomm exploring its application for large multi-chip semiconductors intended for data centers. Qualcomm has also filed for related patents in October 2024.

      The organic bridge technology aims to achieve a high density of interconnections, targeting 5 to 7 layers of redistribution layers, with line widths and spacings ranging from 1.5 to 2 microns, and vias measuring 4 to 5 microns. This results in a pattern density of 500 to 1000 connections per millimeter between chips. Samsung Electro-Mechanics is managing the manufacturing and evaluation of samples in-house while also working with external suppliers and collaborating with Samsung Electronics' wafer foundry for packaging assessments.

      © 2026 KLEA News. All Rights Reserved. This article is provided for informational purposes only. It is not offered or intended to be used as legal, tax, investment, financial, or other advice.

      Source: KLEA News

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