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Samsung Electro-Mechanics and Qualcomm Collaborate on Advanced Packaging Technology
Samsung Electro-Mechanics and Qualcomm are collaborating on the development of organic bridge technology for 2.1D packaging, a project that has been in progress for over a year. This innovative organic bridge technology is designed to connect multiple semiconductor chips within a single package, utilizing organic materials and substrate processes, similar to the silicon bridge technology employed by Intel in its Embedded Multi-Die Interconnect Bridge (EMIB).
In this partnership, Samsung Electro-Mechanics integrates the organic bridge into Flip Chip Ball Grid Array (FC-BGA) substrates, which feature grooves that facilitate the connection of Qualcomm chips. The companies are currently assessing the performance and reliability of this technology, with Qualcomm exploring its application for large multi-chip semiconductors intended for data centers. Qualcomm has also filed for related patents in October 2024.
The organic bridge technology aims to achieve a high density of interconnections, targeting 5 to 7 layers of redistribution layers, with line widths and spacings ranging from 1.5 to 2 microns, and vias measuring 4 to 5 microns. This results in a pattern density of 500 to 1000 connections per millimeter between chips. Samsung Electro-Mechanics is managing the manufacturing and evaluation of samples in-house while also working with external suppliers and collaborating with Samsung Electronics' wafer foundry for packaging assessments.
Source: KLEA News